摘要
为满足微小量程压力传感器在工业工程、航空航天等领域的苛刻使用环境中的高过载的需求,对新型联动薄膜压力敏感芯片进行深入研究。基于单晶硅断裂强度的尺寸效应,利用有限元仿真软件对联动式压力敏感结构的尺寸参数进行仿真优化;通过非线性接触分析确定量程不变时敏感结构尺寸参数与过载能力的关系。仿真结果表明,通过引入悬空可动下极板的联动式压力敏感结构并对尺寸做出优化,可以显著提升压力传感器的过载能力。所设计量程为4 kPa的压力敏感结构,过载能力可达13.5 MPa。
In order to meet the demand of high overload of micro-range pressure sensor in the harsh environment of industrial engineering, aerospace and other fields, a new type of linkage thin film pressure sensitive chip is deeply studied. Based on the size effect of single crystal silicon fracture strength, the size parameters of linkage pressure sensitive structure are simulated and optimized by finite element simulation software. Through nonlinear contact analysis, the relationship between size parameters of sensitive structures and overload capacity is determined when the measuring range is constant. The simulation results show that the overload capacity of the pressure sensor can be significantly improved by introducing the linkage pressure sensitive structure with suspended movable lower plate and optimizing the size. The designed pressure sensitive structure with a measuring range of 4 kPa has an overload capacity of 13.5 MPa.
作者
赵鑫宇
揣荣岩
ZHAO Xinyu;CHUAI Rongyan(School of Information Science and Engineering,Shenyang University of Technology,Shenyang 110870,China)
出处
《微处理机》
2022年第5期17-20,共4页
Microprocessors
