军用薄介质多层陶瓷电容器保证技术研究

Research on Assurance Technology for Military Thik-dielectric MLCC

随着欧美国家技术的成熟,薄介质多层陶瓷电容器(MLCC)已经在宇航和武器装备上广泛应用。随着薄介质MLCC的不断减薄,其应对电应力、热应力和机械应力的可靠性风险不断提升,并出现了新的失效模式。因此,传统的厚介质MLCC的考核已不适用薄介质MLCC。在分析MIL-PRF-123D、 MIL-PRF-55681G、 MIL-PRF-32535A等标准要求和考核试验的基础上,总结了厚介质和薄介质电容器考核要求的差异性,提出了建立薄介质MLCC军用通用规范的必要性和可行性,以便保证薄介质MLCC的高可靠应用,确保宇航和武器装备的高可靠性。

With the maturity of technology in European and American countries, thin-dielectric MLCC have been widely used in aerosapace and weaponry. As thin-dielectric MLCC continue to be thinned, the reliability risks of coping with electrical, thermal, and mechanical stress continue to rise, and new failure modes emerge. Therefore, the evaluation of traditional thik-dielectric MLCC is not suitable for thindielectric MLCC. This paper analyzes the requirements and assessment tests of MIL-PRF-123D、MIL-PRF-55681G、 MIL-PRF-32535A and other standards, and it summarizes the difference in the assessment requirements of thik-dielectric and thin-dielectric. The necessity and feasibility of establishing a military application for thin-dielectric MLCC are proposed to ensure the high reliability of aerospace and weapon equipment.