摘要
电镀镉技术以溶液中是否存在氰化物分为氰化镀镉和无氰镀镉。重点综述无氰镀镉技术的研究现状,探讨在镀镉中还未被广泛应用的络合剂的应用前景,分析添加剂与工艺参数对镉镀层质量的影响以及机械沉积和等离子体沉积等非传统电镀方法的应用,综述无氰镀镉-钛技术及其低氢脆性的特点。
As cadmium electroplating technology is divided into cyanide cadmium plating and cyanide-free cadmium plating depends on the existence of cyanide in the solution, a key overview on the present research status of cyanide-free cadmium plating technology is carried out. The application prospect of some complexing agents yet to be widely used in cadmium plating is discussed. The effects of some additives and process parameters on the quality of cadmium coating and the application of non-traditional electroplating methods such as mechanical deposition and plasma deposition are analyzed. The characteristics of cyanide-free cadmium-titanium electroplating and its low hydrogen embrittlement are reviewed.
作者
宋宜强
皮志超
张泽齐
周飞
SONG Yiqiang;PI Zhichao;ZHANG Zeqi;ZHOU Fei(National Key Laboratory of Helicopter Transmission Technology,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China;Shanghai Hangyi Research Institute of High-tech Development,Shanghai 200433,China)
出处
《机械制造与自动化》
2022年第5期48-53,73,共7页
Machine Building & Automation
关键词
无氰镀镉
络合剂
镉-钛
氢脆
腐蚀
cyanide-free cadmium plating
complexing agent
cadmium-titanium
hydrogen embrittlement
corrosion