摘要
针对目前对压接型绝缘栅双极型晶体管(insulated gate bipolar transistor,IGBT)可靠性评估测试工作的不足,从器件应用角度提出了可用于柔直功率模块的老化循环试验方法。结合不同试验工况下的理想试验波形及热阻模型得到了适用于不同试验的结温波动公式。通过实验验测得到了压接型IGBT在老化试验下的结温波动波形,对所提方法进行了验证。
Since reliability test of Press-pack IGBT(PPI) still not been researched enough, based on its application in industry, A cycle aging test methods aimed at VSC-HVDC power unit are proposed. The junction temperature formulas for all test methods are obtained by analyzing promising test waveforms and thermal impedance models under the specific test conditions. Experiments results illustrate measured junction temperature waveforms of PPI that under the aging tests, and proposed methods are validated.
作者
李标俊
褚海洋
庄志发
文军
LI Biaojun;CHU Haiyang;ZHUANG Zhifa;WEN Jun(Tianshengqiao Bureau,EHV Transmission Company of China Southern Power Grid Co.,Ltd.,Xingyi 562400,China;Rongxin Huiko Electric Co.,Ltd.,Anshan 114051,China)
出处
《中国电力》
CSCD
北大核心
2022年第10期87-91,177,共6页
Electric Power
基金
中国南方电网有限责任公司科技项目(CGYKJXM20180173)。
关键词
压接型IGBT
结温
循环老化
热阻抗
press-pack IGBT
junction-temperature
cycle aging
thermal-impedance
