低热膨胀聚(苯并噁唑-酰亚胺)薄膜与铜黏结性能

Adhesion property between low-thermal-expansion poly(benzoxazole-imide)film and ion-implanted copper

采用氧等离子体活化聚(苯并噁唑-酰亚胺)(PI)薄膜,以此为基底,通过离子注入和化学电镀铜工艺制备高黏结性、耐锡焊性的无胶柔性单面覆铜板(FCCL)。控制气流压强,研究处理功率、处理时间对薄膜表面结构、化学成分及其与Cu层黏结性能的影响。结果表明:氧等离子体改性对改善PI薄膜黏结性能有重要影响,控制压强30 Pa,处理功率100 W,时间10 min,表面引入含氧极性基团,蚀刻明显,使薄膜的浸润性增强;PI薄膜与铜离子形成络合物,进一步赋予FCCL优良的黏结性能,其剥离强度比现有FCCL提高60%以上。

Surface modification of poly(benzoxazole-imide)(PI)film was carried out by means of oxygen plasma treatment.A flexible copper clad laminate(FCCL)was fabricated using Ni-Cr ion implantation and electro-Cu plating process.Controlling the constant pressure,the effects of such treatment conditions as power and time were systematically investigated on the surface roughness,chemical composition and interface adhesion with Cu.It is found that the optical parameters for production of FCCL with excellent adhesion and solder resistance are 50 W/5 min and 100 W/10 min,respectively.Suitable roughness,reactive radical with high content pendent oxygen group,and metal-oxazole complex help to endow exceptional adhesive property to the interface of PI/Cu.And the peel strength of FCCL prepared from PI film with such modified surface rises by 60%.