三模冗余对SRAM型FPGA寄存器上电状态的影响分析

Analysis of XTMR processing results of register power-on state based SRAM FPGA

SRAM型FPGA容易受到空间辐射环境引起的单粒子翻转效应影响,造成软件在轨故障进而影响任务成败,因此在空间应用时普遍采用三模冗余技术进行设计加固来提高软件可靠性。使用Xilinx TMRTool工具实现SRAM型FPGA的三模冗余是目前流行的三模冗余实现方式,该方式无需额外编写代码,简化了设计师的工作。分析了Xilinx TMRTool对软件网表文件的改变流程和机理,对比了三模冗余处理前后FPGA寄存器的不同布局布线结果,分析了三模冗余工具对寄存器置位和复位的影响,给出了以SRAM型FPGA为核心控制器的产品设计建议。

SRAM-based FPGAs in high-radiation environments will almost certainly experience radiation-induced single event upset(SEU),which can cause physical damage to Xilinx FPGAs and result in the software errors and the meaningless works.Therefore,triple modular redundancy(TMR)approach is generally used in the design’s reinforcement to improve the reliability of the software.Xilinx TMRTool implementation is one of the popular ways of TMR.No additional code is required and it simplifies the process of designing an XTMR system.In this paper,writers analysis the changes of netlist and compare the differences of Place&Route implementation with or without TMR.As a result,Xilinx TMRTool modifies the tie of Flip-Flops’SR and REV pins.Some suggestions are given for the product design based on Virtex-II FPGA family.