浅析多次等离子清洗对引线键合质量可靠性的影响

Effect of Plasma Cleaning Times on Wire Bonding Quality Reliability

本文介绍了等离子清洗工艺的基本原理和影响清洗效果的相关因素,通过不同表面材质的引线框架等离子清洗实验,浅析了引线框架经过多次等离子清洗对引线键合质量的影响,分析结论对提高封装产品的可靠性提供了相应的参考依据。

This paper introduces the basic principles of the plasma cleaning process and the relevant factors that affect the cleaning effect.Through the plasma cleaning experiments of lead frames with different surface materials,the influence of the lead frame that multiple plasma cleaning the quality of wire bonding is analyzed.The reliability of packaged products provides a corresponding reference.