铝合金表面镀铜薄膜的制备及其对航空煤油霉菌的抑菌性研究

Preparation of Cu film on Al alloy and its antibacterial property against cladosporium resinae in jet fuel

在蒸发电流135A、基片盘到蒸发源距离13cm条件下,单因素改变基片盘转数和蒸发铜质量,在2024铝合金表面真空蒸发镀铜,研究了基片盘转速(1~17r/min)和蒸发铜质量(1~9g)这2个参数变化对镀铜薄膜抑制树脂枝孢霉生长性能的影响。通过对镀铜薄膜表面金相细观进行观察,揭示了其抑菌率变化与上述制备参数变化之间的内在机理。结果表明:镀铜薄膜对树脂枝孢霉的生长有显著的抑制效果;基片盘转速为1r/min、蒸发铜质量为9g时制备的镀铜薄膜抑菌性能最佳。

Copper(Cu)films were prepared on 2024 aluminum(Al)alloy surface by vacuum thermal evaporation technique under the following conditions:the evaporation current was 135 A,the distance of between substrate disc and evaporation source was 13 cm,changing the single factor of mass of Cu and rotation rate of substrate disc at the same time.The effect of rotation rate of substrate disc(1~17 r/min)and mass of Cu(1~9 g)on the antibacterial property of the Cu films were studied.The internal mechanism between the change of its antibacterial rate and the change of preparation parameters was revealed by metallographic observation of the surface of the Cu films.The results showed that the growth of cladosporium resinae was inhibited by the Cu films.It was found that the Cu films obtained at rotation rate of substrate disc 1 r/min and mass of Cu 9 g had the best antibacterial property.