空间用红外探测器拼接技术研究

Infrared Detector Butted Technology for Space

随着空间遥感相机性能的不断提升,采用更大规模、更多谱段的红外焦平面阵列是未来航天用红外探测器的发展趋势,以满足相机大视场、高分辨率及多光谱探测的能力。目前,单探测器模块的研制受到探测器材料、硅读出电路加工工艺的限制,探测器规模、分辨率、谱段数量等指标无法满足使用要求。因此,通过机械拼接或光学拼接的方式制备大规模、多谱段红外焦平面阵列是必须的工程途经。本文对航天工程用大规模、多谱段红外探测器拼接方式进行了对比分析,给出了各种常见拼接方式的特点,总结了关键技术和核心指标。

To meet the demand for wide field of view,high-resolution,and multispectral detection in space applications,more large-scale bands and infrared focal plane arrays will be the future trend in space remote sensing.Currently,the scale and band of massive array detectors are limited by the sizes of detector materials and processing technology of silicon;thus,they are unable to meet the space requirements for wide field of view,high-resolution,and multispectral detection.Obtaining large-scale and multiband detectors through butting is a practical solution.In this paper,several butting techniques are discussed,and their properties,key technologies,and capabilities are presented.