微量Er、Gd对Cu-Ni-Si合金组织和性能的影响

Effects of Trace Er and Gd on Microstructure and Properties of Cu-Ni-Si Alloy

研究了Er、Gd对Cu-Ni-Si合金的电导率、硬度、强度等影响,利用金相显微镜、扫描电镜、透射电镜、电导率仪、硬度计、万能试验机等方法,结果表明,添加适量的Er能提高合金的强硬度,同时保持其塑性和电导率不下降,但过量的Er会降低其塑性;添加Gd能提高合金的强度,但降低塑性。

The effects of Er and Gd on the electrical conductivity, hardness and strength of Cu-Ni-Si alloy were studied by means of metallographic microscope, scanning electron microscope, transmission electron microscope, conductivity meter, hardness tester and universal testing machine. The result shows that proper Er addition improves the hardness of alloy without weakened plasticity and electrical conductivity, excessive Er reduces the plasticity, and Gd increases the strength and reduces the plasticity.