间苯二甲醛对MSA体系中锡电沉积行为和镀层性能的影响

Effect of isophthalaldehyde on electrodeposition behavior of tin in MSA bath and properties of the coating obtained

通过循环伏安分析、极化曲线测试、扫描电镜(SEM)和X射线衍射(XRD)研究了间苯二甲醛质量浓度对甲基磺酸(MSA)体系电镀锡过程中锡电沉积行为及镀层性能的影响。结果表明,间苯二甲醛能够提高电镀锡的阴极极化能力,有助于获得致密、光亮的镀层。间苯二甲醛质量浓度为0.10 g/L时,电流效率高达99.23%,电沉积速率为57.977μm/h,所得镀层在(220)晶面呈现强织构,表面均匀致密。

The effect of mass concentration of isophthalaldehyde on electrodeposition behavior of tin during electroplating in a methanesulfonic acid(MSA) bath and the properties of the tin coating obtained was studied by cyclic voltammetry,polarization curve measurement, scanning electron microscopy(SEM), and X-ray diffraction(XRD). The results showed that isophthalaldehyde could increase the cathode polarization for tin electroplating, facilitating the formation of a compact and bright coating. The current efficiency was up to 99.23%, the electrodeposition rate was 57.977 μm/h, and the tin coating obtained was uniform and compact with a strong texture of(220) crystal plane when electroplating with 0.10 g/L of isophthalaldehyde.