整平剂对铝基覆铜板通孔电镀铜的影响

Effect of leveling agent on copper electroplating of through hole on aluminum-based copper clad laminate

在由100 g/L CuSO_(4)·5H_(2)O、200 g/L浓硫酸、60 mg/L Cl^(−)、200 mg/L聚乙二醇(PEG-6000)和10 mg/L聚二硫二丙烷磺酸钠(SPS)组成的镀液中加十六烷基三甲基溴化铵(CTAB)、聚乙烯吡咯烷酮(PVP)或2−巯基−5−甲基−1,3,4−噻二唑(MMTD)作为整平剂。通过计时电位曲线测试和热冲击试验,研究了不同整平剂对通孔电镀铜的影响。结果表明,镀液中添加2~4 mg/L CTAB或MMTD时都能够在一定程度上抑制铜电沉积,镀液的深镀能力均符合≥80%的要求。但只有采用4 mg/L MMTD作为整平剂时所得电镀铜层的抗热冲击性能合格。

Different organic compounds i.e.cetyltrimethylammonium bromide(CTAB),polyvinyl pyrrolidone(PVP),and 2-mercapto-5-methyl-1,3,4-thiadiazole(MMTD)were added as a leveling agent respectively to a plating bath containing CuSO_(4)·5H_(2)O 100 g/L,concentrated sulfuric acid 200 g/L,Cl^(−)60 mg/L,polyethylene glycol(PEG-6000)200 mg/L,and sodium polydithiodipropane sulfonate(SPS)10 mg/L.The effects of different leveling agents on copper electroplating of through hole were studied by chronopotentiometry and thermal shock test.The results showed that the electrodeposition of copper could be inhibited at a certain extent when adding 2-4 mg/L of CTAB or MMTD to the bath,and the throwing power met the requirement of not lower than 80%.Only the copper coating prepared with 4 mg/L of MMTD as leveling agent featured qualified thermal shock resistance.