32通道数字阵列模块PCB散热设计

Cooling Design of a 32-Channel Digital Array Module PCB

随着高功率高集成数字阵列雷达的不断涌现,数字阵列模块的散热问题日益突出。本文以32通道数字阵列模块PCB为研究对象开展了热设计研究,提出采用一体化液冷冷板和双层凸台的设计思路,通过热仿真手段对数字阵列模块的内部传热过程进行分析。结果表明,数字阵列模块内部所有器件温度均满足指标要求。同时,研究了凸台形式、凸台宽度与器件温度之间的关系,揭示了双层凸台的散热机理。本文提出的设计思路可为多通道数字阵列模块的散热问题提供更高效的解决手段。

With the emergence of high-power and highly integrated digital array radar,the heat dissipation of digital array module is becoming increasingly prominent.In this paper,the thermal design of a 32-channel digital array module PCB is investigated.The design ideas of integrated cold plate and double-layer convexity are proposed,and the internal heat transfer process of digital array module is analyzed by thermal simulation.The results show that the temperature of all devices in the digital array module meets the requirements.Meanwhile,the influence of the layout and the width of convexity on the device temperature are studied,and the heat dissipation mechanism of the double-layer convexity is revealed.The design ideas proposed in this paper can provide more effective solutions for the heat dissipation of multi-channel digital array module.