Sn-Bi-Ag无铅焊料组织性能研究

Study on Organizational Performance of Sn-Bi-Ag Lead-free Solder

研究了不同含量Bi、Ag元素对Sn-Bi-Ag钎料组织结构及性能的影响。通过金相显微镜观察组织形貌,可焊性测试仪测试可焊性,万能材料试验机测试力学性能。实验结果表明:Bi能有效提高焊料弹性模量,降低熔点。0.7%含量Ag的添加对焊料润湿性影响明显。无铅焊料合金Sn-30Bi-0.7Ag拥有较高的弹性模量、润湿性以及导电性,具有良好的低温焊接能力。

The effect of different Bi,Ag element content on organization structure of Sn-Bi-Ag solder was studied.The structure morphology is observed by metallographic phase microscopy,the solderability is tested by solderability tester,the mechanical property is tested by universal material testing machine.The tests results show:Bi can effectively improve the elastic modulus of solder,and reduce its melting point.The addition amount of 0.7% content's Ag has obvious effect on solder's wettability.The lead-free solder alloy Sn-30Bi-0.7Ag has higher elastic modulus,wettability and conductivity,it has better low temperature welding capacity.