电弧离子镀弧斑运动对膜层质量影响分析

Analysis of Influence of Cathode Spot Movement on Film Quality in Arc Ion Plating Technology

随着薄膜材料在现代工业中的广泛应用,电弧离子镀技术已成为制备功能性膜层的重要方法,在航空航天方面主要面向于功能表面改性、复合材料表面金属化等领域。本文采用磁场控制电弧离子镀靶材表面的弧斑运动,在Ti靶上验证了弧斑在不同磁场下的运动状态,分析了弧斑的运动速度及运动范围。在五种磁场情况下制备Ti N膜层,通过扫描电镜、能谱分析仪、台阶仪、X射线衍射仪等对TiN膜层的表面形貌、微观结构、成分元素、膜层厚度等进行了分析。结果发现,当磁场控制弧斑均匀地分布在整个Ti靶面,且弧斑运动速度加快时,膜层表面大颗粒数最少,膜层最厚,晶体择优生长方向为(111)晶面。

With the wide application of thin film materials in modern industry,arc ion plating technology has become an important method for preparing functional films,such as functional surface modification and surface metallization of composite materials in the field of aerospace.In order to verify the state of cathode spot movement under different magnetic fields,the cathode spot on Ti target was controlled by magnetic field.TiN films were prepared under five magnetic fields,and the surface morphology,microstructure,chemical composition and thickness of TiN film were detected and analyzed through scanning electron microscope,energy disperse spectroscopy,step profiler and X-ray diffractometer.The results show that the film has the least number of large particles,the film is the thickest,and the crystal preferential growth direction is(111)crystal plane,when the cathode spot controlled by the magnetic field is uniformly distributed on the entire Ti target surface and the cathode spot movement speed increased.