焊接工艺下HDI板埋孔区分层的研究

Study on delamination of HDI board buried hole area underwelding process

针对HDI(高密度互连)板在组装工艺中常见的埋孔处分层问题,利用多组实验和ANSYS仿真对分层产生的机理进行了深入研究,提出从设计,材料特性,焊接热,水汽以及填孔工艺5个维度进行根本原因分析的方法。提出更贴近实际组装环境的评估方法,进行更全面的HDI板选型和评估,降低可靠性失效风险。

This paper reviews the common lamination problem in the buried hole area on HDI(High Density Interconnect)board in the assembly process.The mechanism of delamination is deeply studied by experiments and ANSYS simulation,and the method of root cause analysis is proposed from five dimensions:design,material characteristics,welding heat,water and hole flling process.It puts forward an evaluation method closer to the actual assembly environment,carries out a more comprehensive selection and evaluation ofHDI board,and reduces the risk of reliability failure.