高多层印制板树脂塞孔连接盘脱落改善

Improvement of resin plug hole pad peel off about high multi-layerPCB

5G通讯用高多层印制板(层次≥10L)为解决排线密集度高和孔径及间距小的问题,主要采用填孔覆盖电镀(POFV)工艺生产方式。但因板材热膨胀系数匹配度及铜厚附着力等原因,会产生树脂塞孔连接盘(Pad)脱落难点。文章通过POFV工艺掉连接脱落产生原因机理分析和DOE设计实验测试验证,分析及找出掉连接脱落真因,制定相对应改善措施。

In high multi-layer(layer≥10 L),POFV process is mainly used to solve the problems of wide row density and small aperture and low spacing.However,due to the matching degree of plate thermal expansion coefficient and copper thick adhesion and other reasons,the production board by POFV process will produce resin plug hole pad peel off problems.This paper analyzes and finds out the true cause of Pad peel off through mechanism analysis of POFV process and DOE design experiment test verification,formulates corresponding improvement measures.