覆铜板面临的主要问题及应对措施
摘要
本文概述了覆铜板所面临的主要问题,通过深入的探究分析,找出问题的根源所在,提出了相应的应对措施及解决方法。一、背景环氧玻纤布基覆铜板在我国的生产已有50余年的历史,形成了以双氰胺和酚醛树脂为固化剂的两大树脂体系。
出处
《印制电路资讯》
2022年第5期26-32,共7页
Printed Circuit Board Information
二级参考文献16
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共引文献5
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