摘要
由于良好的导电性、机械延展性、化学惰性和生物相容性等优势,金被广泛地应用于电子皮肤器件的开发.多种金材料,如蒸镀金(evaporated Au)、金纳米颗粒(AuNPs)、金纳米线(AuNWs)等,被大量开发和运用于高性能电子皮肤传感和集成器件的制备.本文从材料设计、制备方法和应用出发,重点介绍了热蒸镀金、金纳米颗粒和金纳米线在电子皮肤器件中的应用,最后讨论了金基电子皮肤器件的发展前景和挑战.
Due to its good electrical conductivity,mechanical flexibility,chemical inertness,and biocompatibility,gold(Au)has been widely used in the development of electronic skin devices.Various gold materials,such as evaporated Au,AuNPs,and AuNWs,have been developed and utilized in the fabrication of high-performance electronic skin sensors and integrated devices.This work reviews evaporated Au-,AuNPs-,and AuNWs-based electronic skins,with a focus on material design,fabrication methods,and applications,and finally discusses the prospects and challenges for the development of gold-based electronic skins.
作者
王燕
程文龙
Yan Wang;Wenlong Cheng(Department of Chemical Engineering,Guangdong Technion-Israel Institute of Technology(GTIIT),Shantou 515063,China;Guangdong Provincial Key Laboratory of Materials and Technologies for Energy Conversion,Guangdong Technion-Israel Institute of Technology,Shantou 515063,China;Technion-Israel Institute of Technology(IIT),Haifa 32000,Israel;Department of Chemical&Biological Engineering,Monash University,Victoria 3800,Australia)
出处
《中国科学:化学》
CAS
CSCD
北大核心
2022年第9期1627-1635,共9页
SCIENTIA SINICA Chimica
基金
李嘉诚基金会交叉项目(编号:2022LKSFG12A)
澳大利亚研究基金(编号:DP210101045)资助项目。