SnBi36Ag0.5Cux焊料合金组织、性能研究

Microstructure and Properties of SnBi36Ag0.5Cux Solder Alloy

以SnBi36Ag0.5为基础成分,按质量比熔炼浇铸SnBi36Ag0.5Cux(x=0%、0.1%、0.3%、0.5%、0.7%、1.0%)焊料合金,探讨Cu对SnBi36Ag0.5焊料合金凝固、显微组织、熔点、润湿性、力学性能的影响.使用的计算软件和设备为Thermo-Calc2022a、直读光谱仪、X射线衍射仪、蔡司金相显微镜、场发射扫描电镜能谱(Field Emission Scanning Electron Microscope-Energy Dispersive Spectrometer,FESEM-EDS)、DSC131示差扫描量热仪、可焊性测试仪和万能材料试验机.结果表明:添加Cu后会形成Cu_(6)Sn_(5);随着Cu含量升高,Cu_(6)Sn_(5)逐渐增多,Bi相变细小,分布更均匀;Cu使固、液相线温度略微升高;当Cu含量为0.09%时,润湿时间和润湿力最大;Cu的添加使抗拉强度升高,当Cu含量为0.54%时达到最大值.

SnBi36 Ag0.5 Cux(x=0%,0.1%,0.3%,0.5%,0.7%,1.0%) is melted and casted according to the mass ratio with the basic component SnBi36 Ag0.5.The effects of Cu on solidification, microstructure, melting point, wettability and mechanical properties of SnBi36 Ag0.5 solder alloy were studied.The calculation software and equipment used were Thermo-Calc 2022 a, direct reading spectrometer, X-ray diffractometer, metallographic microscope, field emission scanning electron microscopy-energy dispersive spectrometer(FESEM-EDS),DSC131 differential scanning calorimeter, weldability tester and universal material testing machine.The results show that Cu_(6)Sn_(5) will be formed when Cu is added.With the increase of Cu content, Cu_(6)Sn_(5) gradually increases, Bi phase transition is fine and the distribution is more uniform.Cu will slightly increase the temperature of solids and liquidus.When the content of Cu is 0.09%,the wetting time and wetting force are the largest.The addition of Cu will increase the tensile strength, which reaches the maximum when the content of Cu is 0.54%.