摘要
本文研究了电镀添加剂聚二硫二丙烷磺酸钠(SPS)、3-巯基-1-丙烷磺酸钠(MPS)和整平剂(L)对通孔电镀的均镀能力(TP)影响。借助多物理场耦合方法,计算出不同厚径比通孔内外的流场和电场分布,结合电化学测试手段和通孔电镀实验,研究不同厚径比通孔电镀TP与电镀添加剂体系的相对关系。结果表明,厚径比越大,孔内外的对流差距越大;对于低厚径比(1∶5)通孔,MPS得到的TP最大(2.85);对于高厚径比(6∶1)通孔,整平剂得到的TP最大(0.9)。
The purpose of this article is to study the effects of sodium polydithiodipropane sulfonate(SPS),sodium 3-mercapto-1-propane sulfonate(MPS)and leveling agent(L)on the throwing power(TP)of through-hole(TH)plating.The flow field and electric field distribution of the through-hole are calculated by multi-physics coupling technology.The relative relationship between TP of TH plating and plating additive system with different aspect ratios(ARs)was explored by electrochemical analysis technology and TH plating test.The results showed that the larger AR causes the larger convection dif‐ference between the inside and outside of the TH.For the low ARs(1∶5),MPS caused the largest TP(2.85).For the high ARs(6∶1),L brought the largest TP(0.9).
作者
向静
阮海波
王翀
陈苑明
何为
杨文耀
石东平
赵勇
XIANG Jing;RUAN Haibo;WANG Chong;CHEN Yuanming;HE Wei;YANG Wenyao;SHI Dongping;ZHAO Yong(School of Electronic Information and Electrical Engineering,Chongqing University of Arts and Sciences,Chongqing 402160,China;School of Materials and Energy,University of Electronic Science and Technology of China,Chengdu 610054,China;Chongqing Hangling PCB Co.,Ltd.,Chongqing 402160,China)
出处
《电镀与精饰》
CAS
北大核心
2022年第11期85-90,共6页
Plating & Finishing
基金
重庆市教育委员会科学技术研究项目(KJQN202101321和JQN202101306)
重庆市自然科学基金(2022NSCQ-MSX2217)
中国电子科技集团公司第九研究所揭榜挂帅项目(编号:2022SK-014)
重庆文理学院人才引进项目(R2019FDQ12和R2016DQ11)。
关键词
电镀铜
通孔厚径比
均镀能力
添加剂
多物理场耦合
electroplated copper
aspect ratio of through-hole
throwing power
additive
multi-physics coupling technology
