摘要
采用高温熔融缩聚法,以2,6-二氨基甲苯(2,6-DAT)及4,4′-二氨基二苯甲烷(MDA)为二胺单体,双酚A型二醚二酐(BPADA)为二酐单体,苯甲酸(BA)为溶剂,通过改变两种二胺的比例合成了一系列聚酰亚胺(PI)模塑粉及薄膜,并采用红外光谱、紫外可见光谱、差示扫描量热分析、热重分析和溶解性测试对其进行分析表征。结果表明:制备的PI模塑粉和薄膜已经亚胺化完全,PI薄膜具有良好的光学透过率和热稳定性,PI模塑粉可完全溶解在常见的有机溶剂N,N-二甲基甲酰胺(DMF)、N,N-二甲基乙酰胺(DMAC)和N-甲基吡咯烷酮(NMP)中。
Using 2,6-diaminotoluene(2,6-DAT)and 4,4′-methylenedianiline(MDA)as diamine monomer,4,4′-(4,4′-isopropylidene-diphenoxy)-bis(phthalic anhydride)(BPADA)as dianhydride monomer,benzoic acid as solvent,we synthesized a series of polyimide molding powders and films by changing the ratio of two diamines through high temperature melt polycondensation method.The synthesized polymers were characterized by infrared spectroscopy,ultraviolet-visible spectroscopy,differential scanning calorimetry,thermogravimetric analysis,and solubility test.The results show that the PI molding powders and films have been imidized completely.The PI films have good optical properties and thermal stability,and the PI molding powders can completely dissolve in the common organic solvents such as N,N-dimethylformamide(DMF),N,N-dimethylacetamide(DMAC),and N-methylpyrrolidone(NMP).
作者
卢春燕
王刚
刘帅
刘芸
汪海平
朱天容
胡思前
LU Chunyan;WANG Gang;LIU Shuai;LIU Yun;WANG Haiping;ZHU Tianrong;HU Siqian(Key Laboratory of Optoelectronic Chemical Materials and Devices,Ministry of Education,Jianghan University,Wuhan 430056,China;School of Optoelectronic Materials and Technology,Jianghan University,Wuhan 430056,China)
出处
《绝缘材料》
CAS
北大核心
2022年第11期20-24,共5页
Insulating Materials
基金
国家高技术研究发展计划项目(“863”项目)(2015AA033406)
武汉市人才培养计划项目(20141822)
光电化学材料与器件教育部重点实验室开放基金项目(江汉大学)(JDGD-201711)
关键词
聚酰亚胺
高温熔融缩聚法
模塑粉
薄膜
polyimide
high temperature melt polycondensation method
molding powder
film
