基于LTspice的温度扫描分析方法

Temperature Analysis Method based on LTSpice

环境温度对电路性能有重要影响。通常,人们采用定性的预估方法,或者实验测定方法,来评价电路器件的参数随温度的变化趋势,依此提出相应的温度补偿方案。对于这两种方法,前者较为概略,无法对电路器件参数随温度的变化值作出准确判断;后者较为耗时费力,并且需要足够的资金与精密测量仪器支持。针对这些问题,本文使用仿真手段,举例分析了LTspice电路仿真软件的温度扫描方法,并总结了其优点,利用LTspice的温度扫描功能,可以定量的得到电路器件的参数值随温度的变化曲线,为电路的温度补偿设计提供支持和指明方向。本文也对广泛应用的两类恒流源进行温度扫描分析,根据仿真结果比较了二者的抗温漂能力,结合这两类恒流源的应用市场,指出高性能与低成本并不是相容的设计指标。

Ambient temperature has an important influence on circuit performance.Usually,people use qualitative prediction method or experimental measurement method to evaluate the variation trend of circuit device parameters with temperature,and put forward the corresponding temperature compensation scheme.For these two methods,the former is more general and can not accurately judge the variation of circuit device parameters with temperature;The latter is time-consuming and laborious,and needs sufficient funds and precision measuring instruments.To solve these problems,this paper uses simulation means to analyze temperature scanning method of LTSpice circuit simulation software,and summarizes its advantages.Using the temperature scanning function of LTSpice,we can quantitatively obtain the variation curve of circuit device parameter value with temperature,so as to provide support and point out the direction for circuit temperature compensation design.This paper also analyzes the temperature scanning of two kinds of widely used constant current sources.According to the simulation results,the anti-temperature drift ability of the two kinds of constant current sources is compared.Combined with the application market of the two kinds of constant current sources,it is pointed out that high performance and low cost are not compatible design indexes.