瞬态双界面结壳热阻测量方法的误差分析

Error analysis of the thermal resistance testing technology based on thermal transient method of double interfaces crust

重点分析了瞬态热阻测试方法的原理及最新进展,并针对微电子元器件各工艺过程中“热阻”参数测量准确性、一致性差的问题,对基于热瞬态方法的热阻测试技术进行了误差分析。

Accuracy and consistency of measurement results of such equipment are important for production assessment and application of microelectronic components.This article focuses on analyzing principle and latest progress of transient thermal resistance test method,error analysis of the thermal resistance testing technology based on thermal transient method which is most widely used in thermal resistance field of the microelectronic components,according to this problem of the poor accuracy and consistency of the thermal resistance measurement.