CQFN封装电特性研究

Research on the Electrical Characteristics of CQFN Package

对CQFN封装进行了介绍,探讨了CQFN外壳不同的互连结构及信号完整性的评估方法。针对某款CQFN24陶瓷外壳,研究了封装的信号传输特性;并采用仿真方法对比了不同传输结构对信号完整性的影响。针对差分信号的指标要求,提出了优化传输结构的方法,对于提高CQFN封装电特性具有一定的参考作用。

The CQFN package is introduced,and the different interconnect structures and signal integrity evaluation methods of the CQFN package are discussed.For a CQFN 24 case,the signal transmission characteristics of the package are studied and the influence of different transmission structures on signal integrity is compared by simulation method.Aiming at the index requirements of differentials signals,a method of optimizing the transmission structure is proposed,which has certain reference significance for improving the electrical characteristics of CQFN packages.