摘要
随着我国多晶硅生产技术的不断进步,半导体级多晶硅生产技术水平与国外的整体差距也在不断缩小,并在某些方面可比肩国际一流企业水平。由于国内从事大规模半导体级多晶硅生产技术研究起步较晚,相比于深耕几十年的国外一流企业,在某些细节上依然存在差距,本文主要从技术指标、关键设备材料、生产运营理念等方面分析其存在的差距。
The difference between the production technology level of semiconductor grade polysilicon and abroad is also decreasing,with the continuous progress of Chinese polysilicon production technology,and in some aspects can be comparable to international first-class enterprise level.Due to the late start of large-scale semiconductor grade polysilicon production technology research in China,there is still a gap in some details compared with foreign first-class enterprises that have been working for decades.The article mainly from the technical indicators,key equipment materials,production and operation concepts and other aspects of the analysis of the gap.
作者
杨亮
于跃
陈远新
陈欢欢
YANG Liang;YU Yue;CHEN Yuan-xin;CHEN Huan-huan(Inner Mongolia Daqo New Energy Co.,Ltd.Inner Mongolia)
出处
《中国集成电路》
2022年第11期17-20,共4页
China lntegrated Circuit
关键词
半导体级多晶硅
生产技术
差距
semiconductor grade polysilicon
Production technology
difference