多芯片ESOP封装集成电路产品分层问题研究

Research on delamination problems of multi-chip ESOP integrated circuit

ESOP封装集成电路本身因为底部存在散热片,生产和使用过程中湿气容易从散热片边缘侵入集成电路内部,造成集成电路吸潮和回流焊时出现高温分层问题;多芯片集成电路集成了多个芯片、多种固晶胶水以及多次上芯的生产工艺过程,造成该类集成电路内部各材料间作用力复杂,容易出现结合力降低造成的分层问题。将上述两种结构相结合的多芯片ESOP封装集成电路就存在更大的分层风险。通过上芯工艺设计、材料间可靠性性能研究验证和生产过程控制,可以解决多芯片ESOP封装集成电路分层问题,实现了该类封装产品的大批量稳定性生产。

Because of the heat sink at the bottom of the ESOP integrated circuit,moisture can easily penetrate into the interior of the integrated circuit from the edge of the heat sink during production and operation,such will cause high temperature delamination problems if the integrated circuit encountered moisture absorption or come into soldering reflow process;Multi-chip integrated circuits integrate multiple chips,the production process involves multiple die attach at different times and multiple Epoxy applications,this will create complex forces between materials within an integrated circuit and reduced molding compound adhesive is likely to cause delamination problem.A multi-chip ESOP integrated circuit that combines the above two structures has a greater risk of delamination.The delamination problem of multi-chip ESOP integrated circuits can be solved through the core loading process design,reliability per-formance research verification between materials and production process control,mass production of this type of packaged product is realized with excellent and stable quality.