环境湿度及温度对金刚石串珠胶粘剂开姆洛克213粘接力的影响

Influence of ambient humidity and temperature on the adhesion of diamond bead adhesive Chemlok 213

金刚石串珠要与隔离套粘接起来,必须预先在金刚石串珠表面涂覆胶粘剂,串珠注塑固定常用的胶粘剂为开姆洛克213。但是开姆洛克213涂胶后存放过程,容易受存放环境影响导致胶层性能下降。环境因素包括温度、湿度、压力、辐射、空气质量等多种因素,很多环境因素都会影响胶粘剂的粘接性能,其中温度和湿度是最主要的影响因素。研究发现,环境湿度及温度直接影响开姆洛克213胶粘剂粘接强度,相同温度条件下,开姆洛克213涂胶件粘接强度随施工放置环境湿度升高而下降;相同湿度条件下,开姆洛克213涂胶件粘接强度也同样随施工放置环境温度升高而下降;环境温度和湿度这两种效应的协同作用会进一步加剧开姆洛克213胶粘剂性能的退化。

To bond diamond beads with isolation sleeve,the surface of diamond beads must be coated with adhesive in advance.The adhesive commonly used for bead injection and fixation is Chemlok 213.However,after the storage process of Chemlok 213 glue,it is easy to be affected by the storage environment,which leads to the deterioration of the performance of the adhesive layer.Environmental factors include temperature,humidity,pressure,radiation,air quality and other factors.Many environmental factors will affect the bonding performance of adhesives,among which temperature and humidity are the most important factors.The study result shows that the environmental humidity and temperature directly affect the bond strength of Chemlok 213 adhesive.Under the same temperature condition,the bond strength of Chemlok 213 adhesive decreasesas the humidity of the construction environment increases.Under the same humidity condition,the bond strength of Chemlok 213 adhesive parts also decreases as the ambient temperature of construction and placement increases.The synergistic effect of ambient temperature and humidity further aggravates the degradation of Chemlok 213 adhesive.