钴阳极电流密度对摩擦辅助双阳极电铸镍-钴合金的影响

Effect of current density applied to cobalt anode on friction-assisted double-anode electroforming of Ni-Co alloy

在游离微珠摩擦辅助下,采用镍、钴双阳极电铸Ni-Co合金。研究了镍阳极电流密度为4.0A/dm^(2)时,钴阳极电流密度的变化对Ni-Co合金电铸层性能的影响。结果表明,Ni-Co合金电铸层表面平整、致密,在扫描电镜下可以看到明显的摩擦痕迹。随着钴阳极电流密度增大,Ni-Co合金电铸层的Co质量分数略增,显微硬度降低,晶相结构变化不大。钴阳极电流密度为1.0 A/dm^(2)时所得的Ni-Co合金电铸层表面晶粒最细致,Co质量分数为59.09%,显微硬度达到623 HV。

Electroforming of Ni-Co alloy assisted by the friction of free microbeads was conducted using nickel and cobalt as anodes. The effect of the current density applied to the cobalt anode during electroforming on the properties of Ni-Co alloy was studied when the current density of nickel anode was maintained at 4.0 A/dm^(2). The results showed that the electroformed Ni-Co alloy coating was smooth and compact. Some friction marks were clearly seen on the coating surface under the scanning electron microscope. With the increasing of the current density applied to the cobalt anode, the electroformed Ni-Co alloy showed a slight increase in the mass fraction of Co, a decrease in microhardness, and no significant change in phase structure. The Ni-Co alloy coating electroformed at a current density of 1.0 A/dm^(2) for the cobalt anode had the finest and most compact surface with 59.09% of Co by mass and a microhardness of 623 HV.