蓝宝石孔加工工艺研究

蓝宝石晶体具有高硬度和高耐磨的特性,这一特性也是蓝宝石晶体加工领域面临的主要难题,晶体生长过程复杂,加工过程中易产生“划痕”“裂纹”“崩边”等现象,其可加工性较差,国内的加工主要集中在切割、外圆、平面的研磨抛光。蓝宝石内孔的加工难度系数更大,效率也较低。该文首先比较系统地阐述蓝宝石孔加工前晶向选择和退火的必要性,再从打孔到研磨孔和内孔抛光全过程的加工原理、工艺方法及加工设备进行详细介绍,为实现蓝宝石孔高效率、高精度加工提供参考依据。

Sapphire crystal has high hardness and excellent wear resistance,which are also the main problems in the field of sapphire crystal processing.The crystal growth process is complex,and it is easy to produce"scratches","cracks","edge collapse"and other problems in the processing process,with poor machinability.Domestic processing is mainly concentrated in cutting,grinding and polishing of outer circle and plane,while the processing difficulty coefficient of sapphire inner hole is greater,low efficiency.In this paper,the necessity of crystal orientation selection and annealing before sapphire hole processing is systematically carried out,and then the processing principle,process method and processing equipment of the whole process from drilling to grinding and inner hole polishing are introduced in detail,which provides a reference basis for realizing high efficiency and high precision processing of sapphire holes.