基于电子产品湿热对绝缘及介电强度影响的探讨

Influence of Damp Heat Test of Electronic Products on Insulation Resistance and Dielectric Strength

潮湿环境对产品的影响是不可忽视的,尤其是电子产品。通常情况下,符合安全要求的电子元器件表面在经过湿热试验后不得出现凝露。然而市面仍存在一些元器件在经过该试验后表面出现凝露。有一些技术和方法可以有效地防止凝露在潮湿环境中形成。下面就一些技术方法进行探讨和分析。

The influence in humid environment on products cannot be ignored,especially electronic products.Generally,the surface of electronic components that meet the safety requirements shall not appear condensation after the damp heat test.However,condensation still appears on the surface of some components after the test.Some existing technologies and methods can effectively prevent condensation from forming under the humid environment.Some technical methods are selected to discuss and analyze.