摘要
多层印制电路板的需求越来越大,产品内层图形、压合结构也越来越精细化,复杂化,对多层板层间对准精度要求越来越高。文章通过对一款多层板的生产过程数据分析,验证多层板内层芯板涨缩补偿系数的合理性。
With the increasing demand for multilayer printed circuit boards,the internal pattern and laminating structure of products are becoming more and more refined and complex,and the requirements for the alignment accuracy between layers of multilayer boards are becoming higher and higher.This paper analyzes the production process data of a multi-layer board to verify the rationality of the compensation coefficient of the inner core board of the multi-layer board.
作者
刘锐
邓辉
涂圣考
樊建华
Liu Rui;Deng Hui;Tu Shengkao;Fan Jianhua(Victory Giant Technology(Hui Zhou)Co.,Ltd.Guang Dong,516211)
出处
《印制电路信息》
2022年第11期22-25,共4页
Printed Circuit Information
关键词
印制电路板
涨缩
内层
补偿系数
PCB
Expansion
Inner Layer
Compensation Coefficient