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多层板内层图形补偿系数浅谈

Discussion on the compensation coefficient of inner layer graphics of multilayer board
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摘要 多层印制电路板的需求越来越大,产品内层图形、压合结构也越来越精细化,复杂化,对多层板层间对准精度要求越来越高。文章通过对一款多层板的生产过程数据分析,验证多层板内层芯板涨缩补偿系数的合理性。 With the increasing demand for multilayer printed circuit boards,the internal pattern and laminating structure of products are becoming more and more refined and complex,and the requirements for the alignment accuracy between layers of multilayer boards are becoming higher and higher.This paper analyzes the production process data of a multi-layer board to verify the rationality of the compensation coefficient of the inner core board of the multi-layer board.
作者 刘锐 邓辉 涂圣考 樊建华 Liu Rui;Deng Hui;Tu Shengkao;Fan Jianhua(Victory Giant Technology(Hui Zhou)Co.,Ltd.Guang Dong,516211)
出处 《印制电路信息》 2022年第11期22-25,共4页 Printed Circuit Information
关键词 印制电路板 涨缩 内层 补偿系数 PCB Expansion Inner Layer Compensation Coefficient
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