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半固态加工Ti−Cu合金的显微组织和力学行为

Microstructure and mechanical behavior of Ti−Cu alloys produced by semisolid processing
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摘要 研究触变成形Ti−Cu合金的力学性能。Ti−Cu(25%,27%,29%Cu,质量分数)锭的制备流程为:先进行电弧熔炼,再在950℃均匀化处理24 h,然后在900℃热锻,最后在1035℃热处理300 s后以8 mm/s的速度触变成形。结果显示,触变成形合金表现出良好的力学强度,但其在拉伸载荷下的塑性一般,在压缩载荷下的塑性尚可。随着Cu含量的增加,包晶Ti_(2)Cu相(转变液相区)的体积分数增加,与α+Ti_(2)Cu相区(转变固相区)相比,其力学强度和塑性更低,导致合金的力学强度和塑性降低。这些结果表明,Ti−Cu合金的力学性能和半固态加工性之间的平衡主要取决于Cu含量。 The mechanical properties of Ti−Cu alloys processed via thixoforming were evaluated.Ti−Cu(25,27,and 29 wt.%Cu)ingots were produced via arc melting,homogenization at 950℃ for 24 h,and hot-forging at 900℃,followed by thixoforming at a speed of 8 mm/s after isothermal heat treatment at 1035℃ for 300 s.The thixoformed alloys exhibited good mechanical strength,limited plasticity under tensile loading,and reasonable plasticity under compressive loading.The mechanical strength and plasticity decreased as the Cu content increased as a result of the increasing volume fraction of the peritectic Ti_(2)Cu phase(transformed liquid),which exhibited a lower strength and plasticity than theα+Ti_(2)Cu regions(transformed solid).These findings indicated that the trade-off between the mechanical properties and semisolid processability is largely governed by the Cu content.
作者 Kaio NIITSU CAMPO Caio Chaussêde FREITAS Éder Sócrates Najar LOPES Suk-Chun MOON Rian DIPPENAAR Rubens CARAM Kaio NIITSU CAMPO;Caio Chaussêde FREITAS;Éder Sócrates Najar LOPES;Suk-Chun MOON;Rian DIPPENAAR;Rubens CARAM(School of Mechanical Engineering,University of Campinas,Campinas,SP,Brazil;School of Mechanical,Materials,Mechatronic and Biomedical Engineering,University of Wollongong,Wollongong,NSW,Australia)
出处 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2022年第11期3578-3586,共9页 中国有色金属学报(英文版)
基金 the Brazilian research funding agencies FAPESP(São Paulo Research Foundation) under the grant numbers 2013/24786-3 and 2017/07040-9 CAPES(Federal Agency for the Support and Improvement of Higher Education).
关键词 半固态加工 触变成形 Ti−Cu合金 显微组织 力学性能 semisolid processing thixoforming Ti−Cu alloys microstructure mechanical properties
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