玻璃微珠/环氧树脂复合材料制备和性能研究

Preparation and Properties of Glass Bead/Epoxy Resin Composites

利用溶液共混法将不同尺寸玻璃微珠填料组合填充到环氧树脂基体中,通过固化工艺制备玻璃微珠改性环氧树脂复合材料,研究了玻璃微珠含量对复合材料力学性能、导热和介电特性的影响规律。结果表明:随着玻璃微珠填充含量的增加,复合材料的拉伸强度和弯曲强度明显提升;相比于纯的环氧树脂,玻璃微珠的填充显著增强了环氧树脂基体的力学性能。另外复合材料的平均热导率也随着玻璃微珠填充量的增加而增加;与过去报道的SiO_(2)单一尺寸填充的环氧树脂的热导率相比,本文中所使用的多种尺寸玻璃微珠混合填充的方法明显提升了环氧树脂基体的导热特性。随着填充含量的增加,介电常数和介电损耗同时增加,进一步揭示其介电增强效应主要归因于低频下的界面极化机制。

Glass bead fillers with different sizes were combined into epoxy resin matrix by solution blending method,and the glass bead modified epoxy resin composite was prepared by curing process.The influence of glass bead content on the mechanical properties,thermal conductivity and dielectric properties of the composite was studied.The results showed that the tensile strength and flexural strength of the composites increased significantly with the increase of glass bead content.Compared with pure epoxy resin,the mechanical properties of epoxy resin matrix were significantly enhanced by glass bead filling.In addition,the average thermal conductivity of the composites also increased with the increase of glass bead filling amount.Compared with the thermal conductivity of epoxy resin filled with SiO_(2) in a single size reported in the past,the method of mixed filling of glass beads with used multiple sizes significantly improved the thermal conductivity of epoxy resin matrix.With the increase of the filling content,the dielectric constant and dielectric loss increase simultaneously,which further revealed that the dielectric enhancement effect was mainly attributed to the interface polarization mechanism at low frequencies.