一种陶瓷传输结构截止频率的分析方法

Analysis Method of Cut-off Frequency of Ceramic Transmission Structure

基于高温共烧陶瓷(HTCC)技术制作了电子封装用外壳。通过理论和全波电磁仿真软件分析了陶瓷外壳结构对传输通道截止频率的影响,重点分析了高次模式与传输截止频率之间的关系。研究表明,在以引线键合为主的平面传输结构中,信号线宽度和信号线对地高度与传输截止频率成反比。通过改变信号线宽度和对地高度,传输模型的截止频率由40 GHz提升到70 GHz。利用GSG探针对不同结构的陶瓷绝缘子进行测试,实验结果表明,截止频率与高次模式开始传播的频率具有一致性,验证了该互连结构的截止频率主要是受激发的高次模式的影响,实测值与仿真结果具有很好的一致性。

Based on high temperature co-fired ceramic(HTCC) technology, the housing for electronic packaging is fabricated. The influence of the ceramic housing structure on the cut-off frequency of the transmission channel is analyzed by theoretical and full-wave electromagnetic simulation software, and the relationship between the higher order modes and the cut-off frequency of the transmission is mainly analyzed.The research shows that in the planar transmission structure dominated by wire bonding, the width of the signal line and the height of the signal line to the ground are inversely proportional to the transmission cut-off frequency. By changing the width of the signal line and the height to ground, the cut-off frequency of the transmission model is increased from 40 GHz to 70 GHz. The ceramic insulators with different structures are tested by GSG probes. The experimental results show that the cut-off frequency is consistent with the frequency at which the higher order modes starts to propagate, which verifies that the cut-off frequency of the interconnection structure is mainly affected by the excited higher order modes. And the measured values are in good agreement with the simulation results.