摘要
封框胶是液晶面板中连接薄膜晶体管和彩色滤光片的重要结构,验证其断裂强度是液晶面板可靠性评价工程中需要解决的重要问题.为此开展了封框胶及应用于液晶面板的封框胶的拉伸实验,得到其断裂性能.基于临界应力强度因子的界面端应力模型和回归分析,计算了封框胶胶接结构的临界应力强度因子,建立了含影响因素的液晶面板封框胶断裂强度的预测模型.对比预测结果与实验结果表明,预测模型的误差仅在±20%以内.根据预测模型,得出选择较大泊松比和较小弹性模量的封框胶材料、适当减小界面端结合角、处理胶接界面可提升断裂强度的性能.该预测模型为断裂强度的预测及改善提供了理论依据,在工程应用中具有实际意义.
As an important structure to connect the thin film transistor and the color filter in LCD panels,the sealant itself as well as the verification of its fracture strength has become essential subjects in the reliability evaluation engineering.In this paper,tensile properties of the sealant and LCD panel sealant are obtained by tensile tests.Based on a simple algorithm of the interface stress model of the critical stress intensity factor and regression analyses,the critical stress intensity factor of the sealant bonding structure is calculated,and the prediction models of the fracture strength of LCD panel sealant with influence factors are established.By comparing with experimental results,the test errors of the prediction models lie only within±20%.According to the model,it is suggested that the fracture strength can be increased by means of certain procedures,such as selecting larger Poisson s ratios and smaller elastic moduli,appropriately reducing the interface angle,and treating the bonding interface.The model provides a theoretical basis for the prediction and enhancement of fracture strength,which secures practical significance in engineering applications.
作者
程再军
张旭
颜华生
李愿愿
王建明
伞海生
CHENG Zaijun;ZHANG Xu;YAN Huasheng;LI Yuanyuan;WANG Jianming;SAN Haisheng(School of Opto-electronic and Communication Engineering,Xiamen University of Technology,Xiamen 361024,China;Consumer Quality Department,Xiamen Tianma Microelectronics Co.,Ltd.,Xiamen 361101,China;Pen-Tung Sah Institute of Micro-Nano Scinece and Technology,Xiamen University,Xiamen 361005,China)
出处
《厦门大学学报(自然科学版)》
CAS
CSCD
北大核心
2022年第6期1109-1115,共7页
Journal of Xiamen University:Natural Science
基金
国家自然科学基金(12175190)
福建省自然科学基金(2021J011215)
厦门市青年创新项目(3502Z20206077)
厦门理工学院科研攀登计划项目(XPDKT20011)。
关键词
胶接结构
封框胶
断裂性能
有限元分析方法
临界应力强度因子
性能增强
bonding structure
sealant
fracture properties
finite element analysis method
critical stress intensity factor
performance enhancement