高导热聚酰亚胺电介质薄膜研究进展

Research progress of high thermal conductivity polyimide dielectric films

电子器件高度薄型化、多功能化和集成化的时代,不可避免地会导致复合材料内部的热量积累,严重影响设备的稳定运行和使用寿命,如何实现电介质材料快速且高效的导热散热已成为影响电子设备发展的关键问题.传统聚酰亚胺本征导热系数较低,限制了在电气设备与智能电网等领域中的应用,发展新型高导热聚酰亚胺电介质薄膜材料成为国内外研究重点.本文介绍了复合材料的热传导机制,概述了近年来导热聚酰亚胺薄膜的研究进展与发展现状,重点讨论了导热填料、界面相容、成型工艺对材料导热系数的影响,最后结合导热聚酰亚胺复合电介质材料未来发展的需要,对研究中存在的一些关键科学技术问题进行了总结与展望.

In the era of highly thin,multi-functional and integrated electronic devices,it will inevitably lead to the heat accumulation inside the composite material,thereby seriously affecting the operation stability and service life of the equipment.How to realize the rapid and efficient heat conduction and heat dissipation of dielectric materials has become a bottleneck problem restricting the further development of electronic devices.The intrinsic thermal conductivity of traditional polyimide is low,which limits its application in electrical equipment,smart grid and other fields.The development of new high thermal conductivity polyimide dielectric film materials has become the focus of research.This paper introduces the thermal conduction mechanism of composite materials,summarizes the research progress and development status of thermally conductive polyimide films in recent years,and focuses on the effects of thermally conductive fillers,interface compatibility,and molding process of the thermal conductivity of materials.Finally,some key scientific and technical issues in the research are summarized and prospected in combination with the future development needs of thermally conductive polyimide composite dielectric materials.