高性能导热绝缘环氧封装料的研究进展

Research Progress in High-performance and Thermally Conductive Insulating Epoxy Resin Packaging Material

环氧封装料具有强粘结、高强度、耐高温与耐腐蚀等优点,广泛应用于电子封装领域。随着电子产业的升级换代,环氧封装料在导热、热膨胀、介电和绝缘等性能方面表现不足,阻碍了其在高频与高压等极端条件下的使用,如何解决这些不足是该研究领域的挑战性科学与应用问题。本文首先介绍复合材料的基本导热理论与模型,进而系统综述近年来高导热、低热膨胀、低介电和高击穿环氧封装料领域的研究进展,分析总结其中存在的共性科学问题,并提出解决方法与思路。最后,对环氧封装料在基体、填料、界面及加工等研究方面亟需解决的关键问题及研究重点进行了展望。

Epoxy packaging materials are widely used in the field of electronic packaging because of their advantages of strong adhesion,high strength,high temperature and corrosion resistance.With the upgrading of the electronic industry,epoxy packaging materials are insufficient in thermal conductivity,thermal expansion,dielectric and insulating properties,which hinders their application in extreme conditions such as high frequency and high voltage.How to solve these shortcomings is a challenging scientific and application problem in the field.This paper firstly introduced the basic thermal conductivity theory and model of composite materials,and then systematically reviewed the research progress in the field of epoxy packaging materials with high thermal conductivity,low thermal expansion,low dielectric and high breakdown in recent years.Then,the common scientific problems in them were analyzed and summarized,and the methods and ideas to solve these problems were put forward.Finally,the key problems to be solved in the research of epoxy packaging materials in the matrix,filler,interface,and processing were prospected.