微波光子异质/异构集成技术

Heterogeneous Integration Technologies of Microwave Photonics

微波光子芯片是支撑微波光子学发展的基石。针对微波光子芯片材料体系多样、难以多功能集成等问题,异质/异构集成技术提供了一种有效途径。该技术可将不同材料体系的最优性能器件集成到同一芯片上,大大扩展微波光子芯片的功能,降低微波光子功能模块的体积、重量,并提高其性能稳定性。本文介绍了目前主流的微波光子异质/异构集成技术和光电混合集成方面的主要研究进展,并对未来发展趋势进行展望。

Microwave photonic chip is the basis of supporting the development of microwave photonics. However, no material can satisfy all the requirements of microwave photonic chip. Heterogeneous integration technologies offer an effective way to break through the material limit. It can combine advantages of different materials on a chip. The chip performance on function, size, weight and power are subsequently improved. In this paper, the primary techniques and developments of heterogeneous integration microwave photonics are introduced.