基于三维集成电路带扰流微通道散热特性分析

Analysis of Heat Dissipation Characteristics of Microchannel with Disturbance Based on 3D Integrated Circuits

研究了三维集成电路微通道热沉传热特性,在开放式矩形微通道热沉结构中加入了矩形扰流柱,以改善其传热性能,利用ANSYS Fluent软件对三维集成电路微通道热沉的层流流动和耦合传热方程进行数值计算。实验结果表明,与开放式矩形微通道热沉结构对比,带矩形扰流柱的微通道热沉有着更加良好的传热性能。

In this paper,the heat transfer characteristics of the three⁃dimensional integrated circuit microchannel heat sink were studied.The rectangular spoiler column was added to the open rectangular microchannel heat sink structure to improve its heat transfer performance.The laminar flow and coupled heat transfer equations of the three⁃dimensional integrated circuit microchannel heat sink were numerically calculated by using ANSYS Fluent software.The experimental results showed that compared with the open rectangular microchannel heat sink,the microchannel heat sink with rectangular pin fin had better heat transfer performance.