Bi_(2)O_(3)/B_(2)O_(3)比及β-锂霞石粉对MEMS封接玻璃结构与性能的影响

Effects of Bi_(2)O_(3)/B_(2)O_(3) Ratio andβ-Eucryptite Powder on Structure and Properties of MEMS Sealing Glass

针对微机电系统(MEMS)封接玻璃的性能要求,本文制备了Bi_(2)O_(3)-B_(2)O_(3)-ZnO-BaO-CuO系无铅玻璃粉,采用拉曼光谱仪、X射线衍射仪、热膨胀仪、烧结影像仪、扫描电子显微镜等测试手段分别表征了Bi_(2)O_(3)和B_(2)O_(3)物质的量比(n(Bi_(2)O_(3))/n(B_(2)O_(3)))和β-锂霞石粉掺量变化对玻璃结构、热学性能、封接温度及微观形貌的影响。结果表明:随着n(Bi_(2)O_(3))/n(B_(2)O_(3))的增大,玻璃结构中[BiO_(3)]三角体和[BiO_(6)]八面体单元含量逐渐增多,[BO_(4)]四面体向[BO_(3)]三角体转变,导致玻璃网络连接强度减弱、结构变疏松;随着n(Bi_(2)O_(3))/n(B_(2)O_(3))的增大,玻璃热膨胀系数逐渐增大,特征温度和封接温度逐渐降低,但后期变化放缓;随着β-锂霞石粉外掺量的增加,复合玻璃粉的热膨胀系数明显降低,而特征温度和封接温度没有明显升高,但复合玻璃粉的流动性变差。

A kind of lead-free glass powders based on Bi_(2)O_(3)-B_(2)O_(3)-ZnO-BaO-CuO system was prepared in this paper for the performance requirements of micro-electromechanical system(MEMS)sealing glass.The effects of Bi_(2)O_(3)/B_(2)O_(3) ratio(n(Bi_(2)O_(3))/n(B_(2)O_(3)))andβ-eucryptite powder content on the network structure,thermal properties,sealing temperature and sintered micromorphology of MEMS sealing glass were separately studied by Raman spectra,XRD,coefficient of thermal expansion(CTE),sintering image and SEM.The results show that the content of[BiO_(3)]and[BiO_(6)]increases with the increase of n(Bi_(2)O_(3))/n(B_(2)O_(3)),while the transition from[BO_(4)]tetrahedron to[BO_(3)]triangulation leads to the glass network connection strength weak and structure loose.With the increase of n(Bi_(2)O_(3))/n(B_(2)O_(3)),the CTE of the glass increases while the characteristic temperature and sealing temperature decrease gradually,but later change slowed.The CTE of the composite glass decreases obviously while the characteristic temperature and sealing temperature change little with the increase ofβ-eucryptite powder content,at the same time the fluidity of the composite glass powder becomes worse.