电解铜箔添加剂的研究进展及应用现状

Research Progress and Application Status of Electrolytic Copper Foil Additives

随着锂离子电池用阴极铜箔对其性能要求的提高,迫切需要制造出厚度在6μm以下、抗拉强度在300~350 MPa同时延伸率在10%以上的双光铜箔来满足锂电池的需要。已有的研究发现,通过向电解液中添加适合的添加剂可有效提升铜箔的各项性能。阐述了三种有机添加剂及Cl^(−)在铜沉积过程中的作用,又对不同添加剂之间产生的协同作用进行了归纳。因此,合理利用各类添加剂之间的协同作用,可有效控制铜箔性能,为设计组合添加剂提供了思路与依据。

With the improvement of performance requirements for cathode Cu foils used in lithium ion batteries,it is expected to produce dual-optical Cu foils with thickness of less than 6μm,tensile strength of 300-350 MPa and elongation of more than 10%to meet the needs of lithium ion batteries.Previous studies have found that the properties of copper foil can be effectively improved by adding appropriate additives to the electrolyte.The roles of three organic additives and Cl^(−) in copper deposition are described.Synergies between different additives are induced.Rational use of the synergistic effect of various additives can effectively control the properties of copper foil,which provides ideas and basis for the design of composite additives.