小尺寸高精度薄膜压力传感器研制

Development of Thin Film Pressure Sensor with Small Size and High Accuracy

针对目前溅射薄膜压力传感器由于芯片尺寸较大,导致封装尺寸难以小型化、轻量化问题,利用周边固支小挠度理论,结合ANSYS有限元仿真分析软件,进行小尺寸压力芯片的设计,然后采用研磨抛光和离子束溅射沉积等技术研制出压力芯片,并进行封装,形成更小尺寸的压力传感器。通过对传感器性能测试,静态测试精度达到0.058%,测试精度高,而在高低温下的输出漂移优于典型的薄膜压力传感器指标,且通过在长时间工作情况下的零点输出监测情况,证明传感器具有良好的工作稳定性。

In order to solve the problem that the package size of sputtering film pressure sensor is difficult to be miniaturized and lightweight due to the large chip size,a small size pressure chip is designed by using the theory of small deflection of peripheral fixation combined with ANSYS finite element simulation analysis software.Then the pressure chip is developed by grinding and polishing and ion beam sputtering deposition,and is packaged to form a smaller pressure sensor.Through the performance test of the sensor,the static test accuracy reaches 0.058%,the test accuracy is high,and the output drift at high and low temperature is better than that of the typical thin film pressure sensor index,and through the zero output monitoring in the case of a long time,it is proved that the sensor has good working stability.