聚酰亚胺复合材料电气绝缘性能的研究进展

Research Progress of Electrical Insulation Properties of PI Composites

综述了聚酰亚胺(PI)及其复合材料在电气绝缘领域的最新研究进展,简述了陶瓷类、粘土类、聚硅烷类等无机纳米粒子对PI耐电晕的改性和研究,并从PI基体的分子摩尔极化率和自由体积出发,介绍了不同改性填料对PI介电性能的作用和影响,对PI基复合材料未来在电气绝缘领域的研究方向进行了展望。

The latest research progress of polyimide(PI)and its composite materials in the field of electrical insulation was reviewed,and the modification and study of the corona resistance of PI by inorganic nanoparticles such as ceramics,clay and polysilane were briefly described.Based on the molecular mole polarization and free volume of PI matrix,the effects of different modified fillers on the dielectric properties of PI were introduced.The future research direction of PI matrix composites in the field of electrical insulation was prospected.