衬底温度对铜爆炸箔微观结构及电爆性能的影响

Effect of Substrate Temperature on Microstructure and Electrical Explosion Properties of Copper Explosive Foils

为研究衬底温度对铜爆炸箔微观结构及电爆炸性能的影响,采用磁控溅射在不同衬底温度下制备了铜膜,并采用光刻技术制备了铜爆炸箔。通过X射线衍射仪(XRD)、原子力显微镜(AFM)、四探针电阻率测试仪对铜膜进行了表征,并采用自主搭建的电爆炸测试系统对爆炸箔的电爆炸性能进行了测试。结果表明:随着衬底温度升高,铜膜的内应力和位错密度大幅降低,晶粒尺寸逐渐增大,电阻率先大幅降低后小幅升高;衬底温度为150℃时制备的爆炸箔的峰值功率、能量利用率、沉积能量最优。

In order to study the effect of substrate temperature on the microstructure and electrical explosion properties of copper explosive foil,the copper films were prepared by magnetron sputtering at different temperatures and the corresponding copper explosive foil was prepared by lithography.The copper films were characterized by X-ray diffraction(XRD),atomic force microscopy(AFM)and four-probe resistivity tester,and the electrical explosion properties of copper explosive foil were tested by using a self-built electrical explosion test platform.The results show that with the increase of substrate temperature,the internal stress and dislocation density of the copper film decrease greatly,and the grain size increases gradually;The resistance first decreases significantly and then increases slightly;The peak power,energy utilization rate and deposition energy of the explosive foil prepared at the substrate temperature of 150℃are optimal.