贴片式压力传感器温度响应特性校准装置温压影响研究

Research on Influence of Temperature and Pressure in SMD Pressure Transducer Temperature Characteristics Calibration Device

对贴片式压力传感器温度响应特性校准装置校准腔及压力管路进行温压参数仿真分析及试验研究,结果表明,在绝压2 kPa和500 kPa压力点下,-50℃~100℃温度范围内,校准装置校准腔及压力管路温度分布满足使用要求,实现了标准压力源与高低温校准腔之间的温度隔离,确保了校准装置标准压力值的准确度。

The temperature and pressure parameter simulation analysis and experimental research on the SMD pressure transducer temperature characteristics calibration device have been carried out.The results show that under the absolute pressure of 2 kPa and 500 kPa pressure points, the temperature distribution of the calibration chamber and pressure pipeline of the chip pressure sensor in the temperature range of-50 ℃~100 ℃ meets the requirements for use.The temperature isolation is achieved between the standard pressure source and the high and low temperature calibration chamber.The accuracy of the standard pressure value is ensured when calibrating the temperature response characteristics of the SMD pressure sensor.