整体式蜂窝阵列孔电解加工试验研究

Experimental Research on Electrochemical Machining of Integral Honeycomb Array Holes

针对整体式蜂窝阵列孔电解加工过程中孔壁尺寸控制难题,以壁厚沿孔轴线变化的阵列蜂窝孔为研究对象,对蜂窝孔壁电解成形壁厚尺寸控制进行电场和流场仿真。结果表明:改变阴极加工刃结构、进给速度参数等措施能有效调控侧面加工间隙,进而控制壁厚成形尺寸;附加阴极振动能够改善加工间隙流场,从而提高壁厚成形尺寸一致性。基于仿真优化结果开展整体式蜂窝阵列孔电解加工试验,可控制蜂窝孔壁成形精度在±0.04 mm。

Aiming at the problem of hole wall size control in the process of electrochemical machining of integral honeycomb array holes,the electric field and flow field simulation of the wall thickness control of the honeycomb array holes through electrochemical machining was carried out with the holes whose wall thickness changes along the hole axis as the research object.The result showed that the side machining gap can be effectively controlled by changing the structure of the cathode machining edge and feed speed parameters,and the wall thickness and the forming size could be controlled as result.Meanwhile,the additional cathode vibration can improve the flow field in the machining gap,thus the consistency of wall thickness will be improved.Based on the simulation and optimization results,the electrochemical machining experiment of the integrated honeycomb array hole was carried out,and it was showed that the forming accuracy of the honeycomb hole wall could be controlled within±0.04 mm.