电沉积3D打印图案化微结构工艺优化与应用

Process Optimization and Application of Electrodeposited 3D Printing Patterned Microstructure

通过单因素实验研究了阳极扫描速率和加工电压对成形件整体轮廓、微观形貌及沉积层厚度的影响规律。结果表明:随着阳极扫描速率的增大,成形沉积层的厚度逐渐减小,成形件表面的均匀性与微观结构致密性将得到逐步改善;随着加工电压的增大,沉积层厚度呈现先线性增加后急剧增大的趋势,成形件的直线度、表面均匀性与致密性呈现出先提高后降低的趋势,并逐渐转变为树枝晶状生长。当阳极扫描速率为25μm/s、加工电压为4.6 V时,电沉积3D打印的图案化结构可实现最小层厚0.97μm的打印,内部沉积层之间、沉积层与阴极基底之间均结合紧密。

The effect of anode scanning rate and processing voltage on the overall profile,micro morphology and thickness of deposited layer were studied by single factor experiment.The result showed that with the increase of the anode scanning rate,the thickness of the formed deposition layer decreases gradually,and the surface uniformity and microstructure compactness of the formed parts will improve gradually.With the increase of the processing voltage,the thickness of the deposited layer first increases linearly and then increases sharply.The straightness,surface uniformity and compactness of the formed parts showed a trend of first increasing and then decreasing,and gradually transformed into dendritic growth.When the anode scan rate is 25μm/s and the voltage is 4.6 V,the patterned structure printed by electrodeposition 3D printing can achieve a minimum layer thickness of 0.97μm,the inner deposition layer and the deposition layer with the cathode substrate are closely bonded.