电子封装微纳连接技术及失效行为研究进展

Research progress on micro/nano joining technologies and failure behaviors in electronic packaging

微纳连接技术是电子封装中的关键技术,近年来,随着电子产品逐渐小型化、轻量化的方向发展,各种先进的微纳连接层出不穷,但仍缺少系统的归纳及总结.文中对引线键合技术,熔化微连接技术、软钎焊技术、纳米焊膏烧结技术、导电胶连接技术、表面活化键合技术及新兴的纳米连接技术等具有代表性的微纳连接技术进行了综述,并针对软钎焊焊点在热载荷、电载荷、机械载荷及多物理场耦合作用下微互连的失效行为研究进行了总结.结果表明,未来的微纳连接技术将朝向互连尺寸更加微小,互连方法逐渐智能化,互连材料更加绿色,互连焊点更可靠的方向发展.软钎焊互连焊点的失效行为分析也将逐渐从单一热场、电场载荷的研究拓展至热—电—力多物理场耦合载荷,与实际工况更加贴合,随着如同步辐射,三维X射线等先进表征技术的不断发展,失效行为及机制的研究也将更加精准.

Micro/nano joining are the key technologies in electronic packaging. With the development of electronic products in the direction of miniaturization and lightweight,various advanced micro/nano joining techniques have emerged in an endless flow, but there is still a lack of systematic summary. In this paper, the representative micro-nano bonding technologies are reviewed, including wire bonding, melting micro-bonding, soldering, nano-paste sintering, conductive adhesive bonding, surface-activated bonding and emerging nano joining technology. The failure behaviors of solder joints under thermal, electrical, mechanical and multi-physics coupling load are summarized. In the future, the micro/nano joining technology will be developed in the direction of smaller interconnect size, intelligent interconnect method, green interconnect material and more reliable interconnect solder joint. The failure behavior analysis of solder joints will gradually expand from the study of single load to thermo-electric-mechanical multiple physical field coupling load, which is more suitable for the actual working conditions. With the continuous development of advanced characterization technologies such as synchrotron radiation and 3D X-ray, the study of failure behaviors and mechanisms will also be more accurate.