石蜡相变微胶囊的热学性能与红外隐身性能

Thermal Properties and Infrared Stealth Performance of Paraffin Phase Change Microcapsules

本研究以石蜡(PW)为芯材、三聚氰胺脲醛树脂(MUF)为壁材,采用原位聚合法制备石蜡相变微胶囊(PM)。通过ESEM、FTIR、DSC、红外热成像仪、热循环实验和破碎率测试与分析微胶囊的微观形貌、化学结构、储热性能、红外隐身性能和热稳定性。结果表明,PM1(芯壁比3∶2)和PM2(芯壁比2∶1)具有良好的储热性能,包封率分别为74.82%和75.12%,相变潜热分别为140.54 J/g和141.10 J/g。PM2具有良好的热稳定性,质量损失率为8.8%,破碎率为2.5%。掺PM2的环氧树脂具有良好的红外隐身性能,在80℃水浴加热12 min,PMER-40%(m_(微胶囊)∶m_(环氧树脂)=4∶6)的表面温度比环氧树脂降低了12.9℃。

Paraffin phase change microcapsules were prepared by in-situ polymerization,using paraffin(PW)as core material and melamine urea formaldehyde resin(MUF)as wall material.The micro morphology,chemical structure,heat storage performance,infrared stealth performance and thermal stability of microcapsules were analyzed by ESEM,FTIR,DSC,infrared thermal imager,thermal cycling test and fragmentation test.The results show that PM1(core wall mass ratio 3∶2)and PM2(core wall mass ratio 2∶1)have good heat storage performance,with encapsulation efficiency of 74.82%and 75.12%,respectively,and phase change latent heat of 140.54 J/g and 141.10 J/g,respectively.PM2 has good thermal stability,with the mass loss rate of 8.8%and the fragmentation rate of 2.5%.The epoxy resin doped with PM2 has good infrared stealth performance.When heated in water bath at 80℃for 12 min,the surface temperature of PMER-40%(m(microcapsule)∶m(epoxy resin)=4∶6)is 12.9℃lower than that of epoxy resin.